AllenD
Member level 5
Hi everyone,
Can I ask a few questions concerning the last few steps of the tapeout. I am using TSMC 65nm PDK.
1. My LVS is all set without sealring. However, it reports errors when I added the sealring...It seems LVS recognize the sealring as some device. Is this my problem when I modify the seal ring or is it one of the TSMC bugs? Is there a sealring appnote I should read?
2. I added the Dummy OD_PO and Dummy Metals but some of the density error persists when I run DRC. Does this mean that I might set the M_fill deck wrong?
3. I exported my design with dummy fills into GDS file and re-run the dummy fill command. In theory, the new generated dummy GDS file should be empty. To my surprise, there are new dummy shapes generated. Is this normal?
Thanks
Al
Can I ask a few questions concerning the last few steps of the tapeout. I am using TSMC 65nm PDK.
1. My LVS is all set without sealring. However, it reports errors when I added the sealring...It seems LVS recognize the sealring as some device. Is this my problem when I modify the seal ring or is it one of the TSMC bugs? Is there a sealring appnote I should read?
2. I added the Dummy OD_PO and Dummy Metals but some of the density error persists when I run DRC. Does this mean that I might set the M_fill deck wrong?
3. I exported my design with dummy fills into GDS file and re-run the dummy fill command. In theory, the new generated dummy GDS file should be empty. To my surprise, there are new dummy shapes generated. Is this normal?
Thanks
Al