farhill
Newbie level 5
In HFSS 3D Layout, when you configure the device (die, BGA) as say, flip chip, the bump/ball will auto grow to each pin/pad. Now we need to delete the bumps attached to all non-port pin/pad to avoid shortcircuit. But in 3D Layout when selecting a bump/ball, the whole pin is selected. How to only delete bump/ball but reserve the pin/pad?