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    Pads for MMWave/RF in Digital Process

    I am using a digital process to design MMWAVE and RF circuits.

    I need to design pads (for G S G probing).

    This is for over ten GHz.

    Any resources, papers or thesis on designing pads for these applications?

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    Re: Pads for MMWave/RF in Digital Process

    You don't have too much choice..Read the Probe Manufacturer's Guide and place your pads.
    This a mechanical constraint, you cannot place your pads as you wish..



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    Re: Pads for MMWave/RF in Digital Process

    @BigBoss,

    Thanks for your reply.

    First I have to make them though in the design kit. I understand I need to place them with proper pitch and so on.

    But what layers and so on do I use in the PDK and what guidance (papers, etc) is there for such designs.

    Thank you.



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    Re: Pads for MMWave/RF in Digital Process

    Quote Originally Posted by Puppet123 View Post
    @BigBoss,

    Thanks for your reply.

    First I have to make them though in the design kit. I understand I need to place them with proper pitch and so on.

    But what layers and so on do I use in the PDK and what guidance (papers, etc) is there for such designs.

    Thank you.
    You have to surely use most upper layer .. Isn't it logical ??



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    Re: Pads for MMWave/RF in Digital Process

    @BigBoss, thanks for your reply.

    Yes, I am aware of this.

    Here is a paper screenshot - 65nm CMOS Pads for MMWave Applications.

    Look the sectional view on the left and the top view on the right.

    Question is - the pads on the right and left of the top view - those are just connected to ground or what are they connected to (the ground pads).



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  6. #6
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    Re: Pads for MMWave/RF in Digital Process

    Yes, ground pads are connected to the substrate.

    You should block dummy metal fill under the signal pad.



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