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These ribs/bumps on the power planes are usually done to increase:
- conductivity of copperplane (less powerdissipation, solder is cheaper than choosing higher Cu layer thickness)
- thermal capacitance & surface of copperplane (better cooling of components)
For me, the "white layer" looks like a kind of cheap shielding for sensitive long traces.
We used such a design in Low-cost-products. The paint usually contains some graphite/metallic particles. This is cheaper/faster than optimizing the layout or adding additional components for filtering.
The direction of the tracks was likely chosen to be along the minor dimension of the PCB in order to improve flexibility.
I meant that it would be able to tolerate more flexing without cracks in the solder blobs, or delamination of the copper pours.Perhaps, but isn't the mechanical flexion on the PCB a feature to be avoided ?