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Passives and Substrate Extraction Modeling

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Puppet123

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I am doing layout of a passive component and want to have an optimized modeling of the substrate during layout extraction.

How should the substrate contacts be laid out around a passive component for optimized substrate extraction modeling ?

Just a substrate ring ?

I am using SiGe BiCMOS.

Just a ring of substrate contacts around the passive ?
 

To properly (accurately) model passives, including the impact of substrate, you need to use an EM (electromagnetic) solver - tools like EMX, PeakView, Helic tools, HFSS, etc.
None of the parasitic extraction tool do this accurately, efficiently and robustly enough for practical purposes.

Substrate contact should be placed not for "optimized modeling", but to achieve the desired effect in real life.
 

Thank you.

Can you let me know what you mean by: "Substrate contact should be placed not for "optimized modeling", but to achieve the desired effect in real life."

Can you give me an example ?
 

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