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As i know, "WAT" means "Wafer Accept Test". This test purpose is decide whether fab can ship this lot or not. The general test items of the "WAT" usually relate with FEOL (Frond End of Line) parameters like Vth, Idsat, BV ,.... etc & BEOL (Back End of Line) parameters like contact or via Rc, metal continuity and spacing. Some fab will use the term "E-test" to repalce "WAT".
Besides, FEOL refers to the frond end of the process and BEOL refers to the back end of the process. Generally speaking, process before poly layer is FEOL and after contact layer is BEOL.
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