BGA Package Re-balling Guidance

BGA Package Re-balling Guidance Required

Hi All,

I have 3 Components for BGA Reballing:

1. DDR2 SD RAM

Ball Size : 0.45 mm
Ball Pitch : 0.8 mm
Package Size : 8 mm X 12.5 mm

2. FF1136 BGA

Ball Size : 0.6 mm
Ball Pitch : 1.0 mm
Package Size : 35 mm X 35 mm

3. 208 PBGA

Ball Size : 0.6 mm
Ball Pitch : 1.0 mm
Package Size : 22.10 mm X 16.10 mm


There are 4 Files Attached. 3 are Data sheets for above mentioned components and 1 for a BGA Reball Kit available at my supplier.

The given stencils are not exactly as per our requirements, but there are some stencils with partial parameter matching.

We require:
FF1136 BGA
Ball Size : 0.6 mm
Ball Pitch : 1.0 mm
Package Size : 35 mm X 35 mm

The given stencil is 0.65 mm Ball Size, Pitch 1mm, 41x41 Matrix

DDR2 SD RAM
Ball Size : 0.45 mm
Ball Pitch : 0.8 mm
Package Size : 8 mm X 12.5 mm

The given stencil is 0.78mm Pitch with 0.45mm Ball size
Another is 0.81 Pitch with 0.5mm Ball Size, Matrix 40x40
Another is 0.78 Pitch with 0.5mm Ball Size, Matrix 35x35

Please let me know should I go for these stencils or I need exactly the identical stencils of Package Drawing.

Regards,
Maqbool

I think besides pitch deviation, having stencils with too many positions is already annoying and can make your work really hard. If not easily available from the kit vendor, I would design the stencils with a CAD tool and get it lasered by stencil service provider.

FvM said:

I think besides pitch deviation, having stencils with too many positions is already annoying and can make your work really hard. If not easily available from the kit vendor, I would design the stencils with a CAD tool and get it lasered by stencil service provider.

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I can go for this, but customize order may cost me high either.

Do you need to reball the BGAs so they have tin/lead solder balls?

marce said:

Do you need to reball the BGAs so they have tin/lead solder balls?

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Thank you Marce for taking Interest

We have tried Reflow soldering on the mentioned components. There are few components which we have de-soldered due to bad solder. Now these components have to be reballed so we can use them again.

Also, we need to learn proper methods of BGA Re-balling, that is why I am searching for proper Re-balling kits for these components.

I am expecting a comprehensive response from your side

Best Regards,
Maqbool