pad to copper pour connection through spokes

Is it right to connect SMD component pad to ground copper pour through spokes.
what are advantages?
where should i get info? Or any standard containing this info...

thanks..

Talk to your PCB assembler about their requirements and capabilities. The spokes (thermals) make it easier to solder to the pad since the copper pour will tend to **** heat away from the pad.

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Hey, EDABOARD: ESS-U-CEE-KAY is a perfectly valid word. Not sure why that got censored.

Thermal relief at SMD pads is helpful for hand soldering and rework. It's not required for reflow soldering which heats up the board uniformly.

You don't want thermal relief for pads that use the copper pour as heatsink, neither for pads carrying high current or attempting low inductance connections.

Providing your assembler can assemble SMT boards well......

Some are not so well organised and do not have their soldering profiles set well and thermal balancing is important.
Others are extremely well setup and its not a problem.

No spokes provides the best electrical connection but can be worse for rework as it requires more heat to desolder components and can damage the PCB/component etc.
Thermal relief spokes provides an acceptable electrical connection and allows for rework as it does not draw the heat away.

Having imbalanced connections to a small 2 terminal component (i.e. 0603) can cause tombstoning.
You may not hear of the tombstoning as assembly depts generally just fix it but it does happen, so as a matter of practice board designers will generally thermally relieve a SMT pad going to GND copper when the other goes to a thin trace.

However - if your working with RF boards forget thermal relief - use fully copper flooded connections.

As above "s u c k" is a valid and not offensive word - why has it been removed? (I used "draw" instead.)