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Buried Capacitance in PCB

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ZenXtr

ZenXtr

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Hi all..

I see buried capacitance in a pcb design file for the first time.
Anyone have a quick explain on it?
How do i deal with it?


[original story]
I get the pcb file from a customer.
and i saw this in the layer stack note.

Any thing i need to do about it?
how do i advise PCB maker?
[end of story]
 

Maybe this is optional part, they show this part in some layer, or maybe this is simple mistake of PCB designer, but for sure to eliminate misunderstandings contact customer about this.
 

Power/GND plane layers create burried capacitance, this requires a thin dialectric between the planes and is required for high speed designs.
 

I'm just curious which parts they bury in layers, is this standard part or specially designed, and what they get in space if they bury few parts, except of PCB identification parts or other security EEPROMs/Flash data cases?
 

BURIED CAPACITANCE

http://www.ddmconsulting.com/Design_Guides/bcguide.pdf
**broken link removed**
**broken link removed**
http://www.sanmina.com/pdf/solutions/bc.pdf

The chances are at the moment that he was talking about buried capacitance and not buried components, buried component boards are very expensive (very) and the only ones I have seen are for very high vibration envoironment, rocket powered devices; whereas buried Capacitance is a commonly used method of creating distributed capacitance using the PCB structure, thin dialectrics and power planes.If you read the OP's first post the request for buried capacitance was part of the layer structure so it is as the links above describe, creating it with the PCB layer structure.
If you want to see what components can be emmebdded withing the PCB have a look at Wurth Elektronics PCB site.
 
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    tpetar

    tpetar

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marce said:
BURIED CAPACITANCE

http://www.ddmconsulting.com/Design_Guides/bcguide.pdf
**broken link removed**
**broken link removed**
http://www.sanmina.com/pdf/solutions/bc.pdf

The chances are at the moment that he was talking about buried capacitance and not buried components, buried component boards are very expensive (very) and the only ones I have seen are for very high vibration envoironment, rocket powered devices; whereas buried Capacitance is a commonly used method of creating distributed capacitance using the PCB structure, thin dialectrics and power planes.If you read the OP's first post the request for buried capacitance was part of the layer structure so it is as the links above describe, creating it with the PCB layer structure.
If you want to see what components can be emmebdded withing the PCB have a look at Wurth Elektronics PCB site.
Click to expand...

This is very good materials for explanations of this.

Thanks Marce
 

I use burried capacitance a lot on very high speed designs, it does help a lot.
 

ZenXtr said:
Hi all..

I see buried capacitance in a pcb design file for the first time.
Anyone have a quick explain on it?
How do i deal with it?


[original story]
I get the pcb file from a customer.
and i saw this in the layer stack note.

Any thing i need to do about it?
how do i advise PCB maker?
[end of story]
Click to expand...

You can forward to your PCB maker directly, their engineers will see it when open the file.
Our PCB engineerrs will do so, they will inspect all the designs before start the production.

Regards,
Lynn
 

the maker engineer will advice you if there is any problem about the design.
ZenXtr said:
Hi all..

I see buried capacitance in a pcb design file for the first time.
Anyone have a quick explain on it?
How do i deal with it?


[original story]
I get the pcb file from a customer.
and i saw this in the layer stack note.

Any thing i need to do about it?
how do i advise PCB maker?
[end of story]
Click to expand...
 

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