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Abrading top-side marking: damage internal die?

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jackyzhangsh

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Hi,

If for some reason such as IP security concerns, I don’t want the PCB assembly house to know the actual type of chip that I use, can I abrade the majority its top marking off and leave only the “A1” pin mark?

bgaside.png

Does it depend on the actual type of BGA one is using? For example, like in the figure above, BGA has different variations, and the 1st subfigure above seems having its die closest to the top surface which suggest higher danger of being damaged during abrasion.

I would like to know if abrading top-side marking is a common practice for hiding chip information? How much is the possibility of damaging the internal die?


Jack
 

Well, if you scrape too much, you could, maybe, damage the die.
But, if your BGA needs cooling, you will have to try another way of hiding the markings. Anyhow some of your fellow countryman can easily read out your chip, by opening it and micro probing.
 
ZASto,
ZASto said:
Well, if you scrape too much, you could, maybe, damage the die.
But, if your BGA needs cooling, you will have to try another way of hiding the markings. Anyhow some of your fellow countryman can easily read out your chip, by opening it and micro probing.
Click to expand...

Why "cooling" would make the difference? How can they open and micro probe the chip without damaging it (the assembly house need to give it back to me after soldering)?

Jack
 

ZASto,

I see the message, thanks very much.

Jack
 

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