coolman21
Newbie level 3
On a four layer board after the board has been layed out. should a copper pour be used be used to fill the void area's (top/bottom)
Should the pour be tired to gnd? Can via's be used to tie the two pours together?
What rules should be followed?
Cool
Should the pour be tired to gnd? Can via's be used to tie the two pours together?
What rules should be followed?
Cool