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what are Base DRC and how to fix them and give some information for metal DRC also ..

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qual_ti

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Hi,


What are called as Base DRC and give some examples for them and how to fix them.

Give same information for Metal DRC ALSO
 

Design Rules are a series of parameters provided by semiconductor manufacturers that enable the designer to verify the correctness of a mask set. Design rules are specific to a particular semiconductor manufacturing process. A design rule set specifies certain geometric and connectivity restrictions to ensure sufficient margins to account for variability in semiconductor manufacturing processes, so as to ensure that most of the parts work correctly.
The main objective of design rule checking (DRC) is to achieve a high overall yield and reliability for the design. If design rules are violated the design may not be functional. To meet this goal of improving die yields, DRC has evolved from simple measurement and Boolean checks, to more involved rules that modify existing features, insert new features, and check the entire design for process limitations such as layer density. A completed layout consists not only of the geometric representation of the design, but also data that provides support for the manufacture of the design. While design rule checks do not validate that the design will operate correctly, they are constructed to verify that the structure meets the process constraints for a given design type and process technology.

Some of Metal DRC's
Minimum metal width
Metal to metal spacing
Metal fill density (for processes using CMP)
Antenna check
Metal overhang
Metal shorts

Some other design rule include:
Active to active spacing
Well to well spacing
Minimum channel length of the transistor
ESD and I/O rules

See these links:
Design rule checking - Wikipedia, the free encyclopedia
**broken link removed**
**broken link removed**
**broken link removed**
 
Last edited:
Design Rules are a series of parameters provided by semiconductor manufacturers that enable the designer to verify the correctness of a mask set. Design rules are specific to a particular semiconductor manufacturing process. A design rule set specifies certain geometric and connectivity restrictions to ensure sufficient margins to account for variability in semiconductor manufacturing processes, so as to ensure that most of the parts work correctly.
The main objective of design rule checking (DRC) is to achieve a high overall yield and reliability for the design. If design rules are violated the design may not be functional. To meet this goal of improving die yields, DRC has evolved from simple measurement and Boolean checks, to more involved rules that modify existing features, insert new features, and check the entire design for process limitations such as layer density. A completed layout consists not only of the geometric representation of the design, but also data that provides support for the manufacture of the design. While design rule checks do not validate that the design will operate correctly, they are constructed to verify that the structure meets the process constraints for a given design type and process technology.

Some of Metal DRC's
Minimum metal width
Metal to metal spacing
Metal fill density (for processes using CMP)
Antenna check
Metal overhang
Metal shorts

Some other design rule include:
Active to active spacing
Well to well spacing
Minimum channel length of the transistor
ESD and I/O rules

See these links:
Design rule checking - Wikipedia, the free encyclopedia
**broken link removed**
**broken link removed**
**broken link removed**



Thanks for ur reply.
 

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