What is matching report ?

What is matching report ? What it used for ?

I've never heard that before! What is that for?
Is is for CMOS or BJT or what?
Is is related to the layout design?

VEry courious to know... :lol:

It's for CMOS process .

is it the charactrization report for matcing, from foundary? if it is, it consists of Pelgrom's matching coefficient for the devices.

yes , i get it from UMC

It's part of Standard service of UMC and TSMC for the process under 0.25

It includes the Pelgrom coeff for the mismatch model of equally sized devices.
In general, this is your real limiting factor when designing high speed applications which require two or more identically sized devices. In reality because of process non-idealities these devices will be slightly different in a percentage inversely proportional to the device area. Device mismatch will determine some key performances as for example the input "offset" or even harmonic distortion (also for fully differential circuits). Therefore, in order to minimize the impact of mismatch on your circuit, you need large devices which goes at the expense of more power consumption for the same desired speed.

nathan

the meaning of matching is for MOSFET;
mosfet beta is defined the channel L and W and Vth and oters when fabricating MOSFET , there is some difference between MOSFET even they are very closly layouted caused from etching or neigbering device.
so MOSFET matching is the facter of distance between MOSFETs and of the mumber of fingers and of channel length direction means if MOSFETs are layouted 90 deg it causes wrong matching
usualy fab prosess shows the characteristics , if u want to make matching between MOSFETs such as precise differential amp u have to follow the rule

for resister, also it has matching characteristics the deviation in the wafer is around 2 percent. if u use resister loaded amp u may be carefull of resister matching

for capacitor also it has matching characteristics the deviation in the
wafer is around 2 percent it is smaller than fluctuation of fabrication process

conclusion;
even in one die there is deviation of characteristics of device