jayleung
Member level 5
Hi, everyone. I have a question about the minimum component spacing in the automatic pick-and-place assemble process.
Let's say that I design a complete circuit with all kinds of components, with QFN, TSSOP, SOIC ics, and 0402,0603,0805 capacitors and resistors. So how close those components can be in the automatic pick-and-place assemble process? For example, for a 4mmx4mm QFN (160x160mil^2) package, can I place a 0402 (40x20mil^2) decoupling capacitor 20mil away from the IC? Or 40mil?
Thanks.
Let's say that I design a complete circuit with all kinds of components, with QFN, TSSOP, SOIC ics, and 0402,0603,0805 capacitors and resistors. So how close those components can be in the automatic pick-and-place assemble process? For example, for a 4mmx4mm QFN (160x160mil^2) package, can I place a 0402 (40x20mil^2) decoupling capacitor 20mil away from the IC? Or 40mil?
Thanks.