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Failure analysis - who to blame?

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elfrec

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I have a question.

There is always RMA from the customer side. We, as designer house, will only can send the failed IC to the supplier for failure analysis.

From the IC failure analysis, they will always blame ESD or EOS as the cause of the failure. However, they never specify what thing will cause this ESD/EOS problem happen.

They are four party involved. Customer, designer house, IC supplier and manufacturer, normally, how could you prove which party cause the problem?

Thank you.

Regards,
Elfrec
 

You should send the IC to an independent failure analysis provider if at all possible. If you cannot do so, then make sure you see the F.A. report generted by the IC foundry. ESD/EOS has a very particular failure signature when deprocessed and studied under the electron microscope. Also, the IC foundry process should provide some immunity to ESD so ask them why their process did not work.
 

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