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how to reduce solder void issue on LGA (Land Grid Array)??

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safwati

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solder void

hi..

does anyone know and have experience with LGA (Land Grid Array)?
i would like to know how if i want to reduce the solder void issue.

as far as i know for BGA the max solder void % is 25%. but for LGA, there is no spec yet in IPC.

how the PCB design, stencil opening, solder paste and reflow profile affect solder void?
 

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