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Hi all !!!
Why is more space recommended between Copper shape to Copper Shape and Copper shape to any other feature (copper feature) on the pcb.
For eg : normal isolation between copper shape to through hole is more than through hole to through hole.
I have a GB Ethernet connector to which I have to connect 4 pairs of differential pairs .Now I want to match the length of all the pairs (and individual nets) to same length .how do I set the constraint and Also how do I apply the trace tuning.
I am new to allegro tool ...
Thanks for the...
I am new to allegro tool and currently started with 16.3 version.
I am finding the tool little difficult as regards to mentor tools ,may be bcos i try to think in terms of mentor tool flow.
I need a big help in understanding defining the constraints in constraint manager .Little...
for CID certification you can contact alpha imager (https://www.alphaimager.com/).They conducted Cid exams in banglore.CID+ am not sure if its available in india as yet.I fyou need any more info i think you should talk to guys @ alpha imager or mail to : DC-Coordinator@ipc.org.
Hope this helps
MMC and LMC
Can somebody explain the terms Maximum Material Condition and Least material Condition? I have read the definiton of these terms but am still confused!!!
How does MMC of a hole be when it has the smallest diameter and LMC of hole be when the diameter is largest ?
I was checking out (learning rather)the tandem routing rule.There are 2 rules to be set,The gap and Length .I would like to know what the gap rule is .Is it distance 'x' as shown in fig 1 or as shown in fig 2.
If its like in Fig 1 Then wouldnt it be the width of the...
I was also thinkng about the unit ..does anyone have idea regarding the units fo this formula?
Also Stripline Config
Can the two layers sandwiching the trace layer be of different materials?I mean different dielectric.
Do we normally have stacks with different dielectric between layers.?
controlled impedance routing
Hi all ,
I have a doubt. With respect to below given stack up ,Can we implement Controlled impedance routing in the TOP LAYER?If No why? If yes is the normal formula
Z = 87/Sqr(εr+1.41) +ln(5.98h/0.8w+t)
t= thickness of cuppoer foil
w = width of trace
H - Height...
How do we decide the thickness of trace to be used for a signal.Say for example we are considering the current flowing through the trace.Any formula ?
Also Does larger width of trace improve signal quality for higher speed signals?