senilicus
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Hello all,
At the moment I am working on a design that carries several high speed signals, (40Mbit, 10Mbit). There is no soldermask on these traces and
we need a finish for those traces.
ENIG or ENIPIG are not possible because of the nickel and immersion silver wil oxidate over time.
One of the possible finishes could be Electroless Palladium/Autocatalytic Gold (EPAG, EPIG)) but this appears to be a finish that not much
pcb manufacturers offer.
Any suggestions?
- - - Updated - - -
What a mistake I made.
The signals are 40Gbit an 10Gbit. a bit faster.
At the moment I am working on a design that carries several high speed signals, (40Mbit, 10Mbit). There is no soldermask on these traces and
we need a finish for those traces.
ENIG or ENIPIG are not possible because of the nickel and immersion silver wil oxidate over time.
One of the possible finishes could be Electroless Palladium/Autocatalytic Gold (EPAG, EPIG)) but this appears to be a finish that not much
pcb manufacturers offer.
Any suggestions?
- - - Updated - - -
What a mistake I made.
The signals are 40Gbit an 10Gbit. a bit faster.
Hello all,
At the moment I am working on a design that carries several high speed signals, (40Mbit, 10Mbit). There is no soldermask on these traces and
we need a finish for those traces.
ENIG or ENIPIG are not possible because of the nickel and immersion silver wil oxidate over time.
One of the possible finishes could be Electroless Palladium/Autocatalytic Gold (EPAG, EPIG)) but this appears to be a finish that not much
pcb manufacturers offer.
Any suggestions?
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