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RF (Bluetooth Module) Grounding in PCB Layout (4 Layered)

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smith_suez

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Hi ,
I am using bluetooth module(F2M03AC2 from FREE2MOVE)in my project.In the datasheet they have suggested to connect directly all the GND Pads to flooded GND plane.ALso if more than one GND is used make a connection between them using as many as vias.
In the layer stack up i have GND Plane below the TOP Layer were the module is mounted.
My question is ,will there be any issues when i connect directly the GND of Bluetooth module to the GND plane below to which rest of the circuit GND is connected.Will there be performance/EMI/SI issue in the rest of the circuit/ Bluettoth module...Please help
 

Re: RF (Bluetooth Module) Grounding in PCB Layout (4 Layered

Hi,

Blue tooth module is directly connected to the gnd plane,this is actually a good practise,your suppressing the noise to the ground plane and try to make a separate segration of module from the other function block.

For more information about the subject,check this sites you might get answer for your query..

https://www.radio-electronics.com/

https://www.sopcco.com/an4005__WirelessUSB_LS_Printed_Circuit_Board_Layout_Guidelines.pdf

https://www.jlab.org/accel/eecad/pdf/050rfdesign.pdf


Regards

Ramesh
 

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    smith_suez

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Re: RF (Bluetooth Module) Grounding in PCB Layout (4 Layered

I would suggest to add capacitor component pad at each of the I/O pins with the following condition :

1.) Must place directly at Bluetooth module I/O pins;

2.) Capacitor gnd should directly loop back to Bluetooth module gnd. This is very, very important for Bluetooth module P.A. Vdd, P.A. on/off control.

The purpose of these caps. are for EMC issue especially 2nd harmonic. Very often emc failure is caused by leakage at I/O pins.

Rogerynt
 

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