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Contact is connection to source, drain or poly. While vias is used to make connection between two metal layers. Both vias and contact are formed using metals. Vias are generally made of tungsten while contact is made using aluminum.
Contact is connection to source, drain or poly. While vias is used to make connection between two metal layers. Both vias and contact are formed using metals. Vias are generally made of tungsten while contact is made using aluminum.
Hi Yadavvlsi,
Thanks much for the clear information. Are these diagrams taken from some book or document. Will appreciate if you can point us to the source...
I am a RTL guy and a complete newbie when it comes to PD. Can you please point to some resources to help me get started...
Contact is the hole in the dielectric to make connection between Metal 1 and underlying Polysilicon or doped Silicon.
Polysilicon is mainly used as gate material in MOSFET and n or p-doped silicon is used as Source/Drain regions.
Via is the hole in the dielectric to make connection between two metal layers. Example: Metal 1 to Metal 2, Metal 2 to Metal 3, etc.
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