jackyzhangsh
Junior Member level 2
Hi,
If for some reason such as IP security concerns, I don’t want the PCB assembly house to know the actual type of chip that I use, can I abrade the majority its top marking off and leave only the “A1” pin mark?
Does it depend on the actual type of BGA one is using? For example, like in the figure above, BGA has different variations, and the 1st subfigure above seems having its die closest to the top surface which suggest higher danger of being damaged during abrasion.
I would like to know if abrading top-side marking is a common practice for hiding chip information? How much is the possibility of damaging the internal die?
Jack
If for some reason such as IP security concerns, I don’t want the PCB assembly house to know the actual type of chip that I use, can I abrade the majority its top marking off and leave only the “A1” pin mark?
Does it depend on the actual type of BGA one is using? For example, like in the figure above, BGA has different variations, and the 1st subfigure above seems having its die closest to the top surface which suggest higher danger of being damaged during abrasion.
I would like to know if abrading top-side marking is a common practice for hiding chip information? How much is the possibility of damaging the internal die?
Jack