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Yup, Its mentioned as 'Double PO patterning' in DRD and 'Poly double cut' in Layer Usage Description file. Read the Design Rule Document it contains every info you wanted....
we can identify the top & bottom plate by checking the layers. For eg: if a mim is comprising of Poly to M3 metal layers, Poly will be the bottom & M3 will be the top. For connection purpose you need to follow the MIM layout rules in the Design rule document.:grin:
Yes , its correct what Sergio told, TSMC 28nm is not using Double Pattern Lithography.But Cut masks are used only in DPL. Can you tell what exactly is the lithographic process used in TSMC 28nm.
Regards
Sreehariii.......
Hi all thanx for all your responses...
But I read like thin gate should be used in preference to thick gate for better matching in the book Art of Analog layout by Alan Hasting Page No.442 4rt para. If someone knows the answer for this please reply.
Thanks & Regards
Srihariii
Hii all
Please tell the usage of "schiCreateSymbolShape" skill command, Is it same as "schHICreateSymbolShape" else whats the difference.
Thanks & Regards
Srihariii
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