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your answer seems correct. A ground stitched VIA or a stitched capacitor is required when changing reference layer or if a signal is routing in multiple layer. This is to avoid EMI issues. You also need to make sure to re-calculate trace impedance for those layers where transition is happening.
Books:
Right the first time is a useful book for beginners as mentioned above.
High Speed Digital Design: A Handbook of Black Magic Hardcover – by Howard Johnson
Signal & Power integrity by -Eric Bogatin
There are several free calculation tools available on internet. You can check them. I found...
1. To meet standard board thickness two or more pcs of prepreg is used. Its common practice. Make sure you request any stackup always mention if there is any impedance matching requirements. Impedance depends on P/P & Core thickness & PCB material as well.
2. Usually same material is used for...
beside reliability, surface finish requirements depends on how frequently you need to plug in /plug out board & components... Certain areas require thick plating. For edge finger (Hard gold) 50uin Au over 200uin Ni is recommended. If you use any smt socket (for your chip/ic) or any smt plug in...
Hi fellows,
I would like to know, how to get xy location (co-ordinates) of circles or any shape drawn in DXF, using Autocad 2013. Is that possible to export Autocad DXF/DWG in text format to get those locations? I have dxf provided by my client & they may want to get xy location of those...
Hi Fellows,
I wonder if anybody could help me to verify the Trace Width to match 85Ohm impedance for Differential pairs (surface microstrip) for a two layer board. Currently I have used 12mil/0.3mm trace width with 5.5mil separation. TOP side would have these pairs & BOT would be a GND copper...
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