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cds_lic_file or lm_license_file
Thank you hann.
I could verify that the CDS_LIC_FILE variable was set somewhere during the startup process. I'm still struggling to find out, at which point that happens.
Unfortunately, I cant' influence which license file is being used.
I can set the...
cds_lic_file
Thanks for your respnse, haann.
I checked <cdsroot>/share and .cdsinit
but I couldn't find the license file/server definition there.
Is there a way to check the used environment variables directly within the CIW?
At least, they don't appear in the shell, the ICFB-CIW was started...
cds_lic_file
Hi,
I would need an advice regarding the license file location setup:
Usually (as far as I know), the "icfb" should get the information where to find the license file / license server from the environment variables CDS_LIC_FILE or LM_LICENSE_FILE.
In the company I am currently...
Re: problem using transient simulation in IC5141USR2 using F
Try the Unix-command "sync" in a shell/terminal.
Maybe you need root permissions in this shell, depending on your installation.
It helps sometimes, unfortunately not always.
I'm currently investigating this problem.
in which process-technology do you have to make this design? BICMOS? Double-Well? I have experience in a +/- 12V (24V) Amplifier-Desing for ADSL in 0.6um-BICMOS.
Its not 70V, but maybe I can help a little bit with my experience. What is the design-task? Amplifier, charge-pumps,...?
peterlaaser
a typical 1-mil-bondwire can take up to 500mA. The critical bottleneck is the pad itself. most standard-pads are not optimized for high currents and get electromigration-problems above 100mA. But if you stack 5 or more metallayers you can build a 500mA Supply-Pad yourself.
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