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Hi there,
thanks for your reply,
but I am investigating some packaging issues with my circuit.
I do have a good simulation in hfss of the package and I also have my RFOW measurements of the circuit.
I do not underestimate ads capabilities but I need to integrate the package effect from HFSS in...
Hi Guys,
I have a question....
I am trying to simulate an Hybrid circuit that is a series of
microstrip+active device+microstrip
the three are connected together by bondwire, and enclosed in a box.
I also have the RFOW measurements of the active device.
I design in hfss the entire enclosure...
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