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companies using design software
look like no one interested this topic at all... very disappointed... :(
some one please cancel this post for me...i dun know how to close ths post..
Thank you...
top ten pcb designing sofwares
@ltium designer winter 09 is the best....
Try the free trial (full version)
https://www.altium.com/products/altium-designer/en/altium-designer_home.cfm
pcb design software used by companies
As per topic...
i wish to know in the market which big company are using which type of pcb design software?
Appreciate if anyone can update the list below which pcb software they company using now.
Intel = Cad@nce @llegro
Sony = Zuk3n
Balda Solution...
Sorry, the one that i downloaded is Ansoft Designer SV...not HFSS, any different between this two software? can i design F Antenna using Ansoft Designer SV? and how to use it? please advise...
I am totally new in this "Antanna Design" and I had downloaded H/F/S/S sduent version but don't know how to use it....can anyone help me on this....? any tutorial pdf out there?
2.45 ghz antennas
Actually i dun have any specify design spec, what kind of design spec should i have? please advise... what i want is the smallest size F-antenna which can transmit at 2.45GHz (bluetooth range)...
Any good antenna software which can simulate F-antenna easily?
freescale f antenna
I need 2.45GHz F-Antenna design guideline, please help...
can two diffrence frequency antenna (2.45GHz and 433MHz) design on a some pcb?
please advise....
Thanks for the replys..... Ya...currently i deal with CSR chipset which is 0.5mm pitch, remove some pad are possible...but remove some ball on the CSR chip.... i not think so....(have to customize the chip), so...i think remove the BGA pad not a good ideal...
What will be the recommended via...
i plan to remove those pads and cover with soldermask, that's mean trace will go under the soldermask and it will not have contect with the BGA solder ball, what i affair is when doing the reflow in the SMT, those BGA pin/solder ball (which no pads under it) may cause solder join for other...
Hi guys...i need your advise,
Currently i had working with a 0.5mm pitch BGA, because some of those BGA pads are not used, i plan to remove those pad in over to place a trace under it? will it cause any solder join problems after SMT process? have anyone face this kind of issue before?
Please...
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