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Thanks for the jpg.
I tried something similar and that fixed the Via issue. however the thermal reliefs on all other pads are now very thin.
So I will continue to investigate.
These rules are difficult to comprehend but I must admit their pretty darn powerful.
I'm glad I didn't stay with...
I have used the Polyfill for laying ground planes on both Top and Bottom layers.
Vias are then added to tie the two Gnd planes.
Component pad connecting to Gnd must have thermal reliefs, however I want the Vias to be direct connected.
What is the best way of achieving this?
Atmel! Go to Atmel download the latest Studio for AVR. ( AVR Studio 4.12 (build 460)
Download WINAVR https://sourceforge.net/projects/winavr/
install WINAVR first
No code limitation and the C is open source. It doesn't have all the bells and whistles of commercial packages, but it is real...
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