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I have Ott's book on order from Amazon. The idea if only crossing the split on the top layer since the full ground plane is under the top signal layer sounds like a worthy goal.
Thanks. I am now wondering if stitching capacitors might be necessary. I don't have any high speed signals crossing the gap in the split power plane so maybe I'm just being paranoid. I found this article referenced in another post. Sounds like you would need better equipment than I have...
I am in the process of re-laying out an existing 2 layer board into a 4 layer board. One half of the board is I/O, micro-controller, and supporting components. The other half are high side intelligent power MOSFET's. The 2 layer board is having EMI issues with a large DC pump motor. The...
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