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Actually the IPC standard Class 3 calls out for a minimum of .020mm thickness with an average thickness of .025mm. Granted you are trying to achieve .025mm overall plated average, but the thin areas can go down to .020mm.
They are telling that the thick layers are due to having to plate the .008 holes to .000787 minimum thickness on the walls. The 4.88 mil layer is an outer layer, except in the case of one of the bottom two layers with the blind vias. Is 1 mil final copper thickness possible with .8 mil vias...
I am a mechanical engineer that is responsible for also producing PCB drawings for manufacture. We send these drawings out with a set of gerber files to the manufacturing houses to specify what we need from our designs. Recently we have been trying to greatly improve what we specify on our...
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