Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.
Hello.
I am trying to design a substrate for a flipchip Package.
I imported the die information thru the die text in wizard.(number of bumps is roughly around 2200).
Created the BGA thru the BGA generator (27X27 BGA , 0.8mm pitch, full array with 1:1:4 for pwr/gnd/signal distribution)...
This site uses cookies to help personalise content, tailor your experience and to keep you logged in if you register.
By continuing to use this site, you are consenting to our use of cookies.