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Generally designers make as tiny as possible the size of the pads. It's the reason why I'm looking for informations to take part of the design on this point. What I found is when the size of the pad goes down, the best way is the wedge bonding, wire diameter mini is 17um (for one supplier, I...
Hi everyone,
In our lab, we are going to design with 65nm technology. I'm responsible of a team who's in charge of microelectronics integration. We'll have to bond on pad in 65nm technology and I have no idea for the pads size. We allready "wedge bonded" many and many chips with pad size around...
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