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automatic fill will introduce large capacitive to my Power amplifier, while manual fill is seemed impossible as the metal density requirement can be fulfilled even all possible area are placed dummy metals.
Dear friends, I am working in RF circuit design project using 65nm tech. There is strict requirement on local metal density. Auto-fill utility can help but greatly affect circuit performance. Manual dummy metal fill is used but it seems not very useful.
Any suggestion?
Dear friends, I am working in RF circuit design project using 65nm tech. There is strict requirement on local metal density. Auto-fill utility can help but greatly affect circuit performance. Manual dummy metal fill is used but it seems not very useful.
Any suggestion?
Dear friends,
I am trying to figure out how many no of bit a DAC is required, of a D8PSK modulation application in a IQ transmitter.
Theoretically, there are only 5 states involved for either positive or negative sign, thus 4bits (1 sign bit is already included) are sufficient. However, the...
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