Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.
Re: what is metal filling ?why it is using after complting r
This is completely wrong. It has nothing to do with EM. It is used to gain a better uniformity during CMP process.
Basically it is not needed to connect the dummy fill to any metals because they are mainly needed to solve the ILD uniformity issue during CMP. They should be either floating or grounded and not abutted to other active metal structures. Pattern Density was the thing which matters in CMP, that is...
This site uses cookies to help personalise content, tailor your experience and to keep you logged in if you register.
By continuing to use this site, you are consenting to our use of cookies.
