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Mainly I am using these vias for decoupling capacitors. Are blind/buried or backdrilled vias necessary for decoupling? I've read from TI that they help at high speeds due to the lower inductance.
focus.ti.com/lit/an/sloa069/sloa069.pdf
I've built a board with 6 layers with blind vias, and the stackup is like this:
Top routing/components
Ground
Power1
Power2
Power3
Bottom routing/components
The blind vias run from: top-ground (1-2), top-power1(1-3), top-power2(1-4), top-power3 (1-5), bottom-ground (6-2), bottom-power1(6-3)...
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