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hr poly resistor
poly reistor have not high resistivity its accuracy will be best than others. the high resistivity resistors are HR poly or well resistors.
pad or bond pad?
pad always contains esd structures also so its size will be more than opening.
1 will define the opening of the pad after passivation .
2 will define the size of the pad.
3 will define the minimum spacing between two pads.
nitride edge?
fox used to make seperation between devices on substrate. but the hight of this fox will be apprx. 6000a . this much hight can not eatch. so to avoid to grow the fox on the active area , active area can be defined by nitride. fox can not grow on nitride and there will be a small...
twin-well process
I think CMOS technology process is twin well process. bcoz if u want to fabricate pmos in p substrate u need a nwell simultaneously when u fabricate nmos u need to pwell. this pwell is not defined by layer but the same layer of nwell can used with negative photoresist, means...
generaly there are two type of pads used in IC designing. input and output pads. generally input goes to the gate of mos and output comes from drain or source. to prevent gate from ESD we use diode protection simultaneously with resistor. if input or output does not goes to gate any one can use...
there many kinds of calibration schemes for 1.5b/stage pipelined ADC!
if you want schematics, I am afraid there are not much on web!
some IEEE papers may be helpful:
"Digital_Domain Calibration of Multistep Analog-to-Digital Converters"
"Background Digital Calibration Techniques for...
lv9 hspice
mp d g s b p w=20u l=2u
*********** FORCES *********
vd1 d1 0 dc x
vg2 g2 0 dc 4v
vs2 s2 0 dc 5
vb2 b2 0 dc 5
********* ANALYSIS *********
.op
.tran 1n 10n
.dc x 0 5v .1v
****** VT CURVE********
.print 'VT_P'=LV9(mp)
******IDS_VDS CURVE********
.print...
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