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7th August 2014
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Threads 1 to 9 of 9
Forum: Thermal Management
JEDEC component thermal models, Statistical estimation of circuit heat dissipation, ECAD/MCAD data exchange, CFD simulation and boundary conditions, Multi-physics simulations, Temperature management, Determining heat and temperature distributions in PCBs, Metal core CCAs, Resistance network thermal modeling (e.g. Sauna,SINDA), Cold plate integration, TECs, Vapor chambers and heat pipes
