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confused by packaging issues

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youyang

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I have some questions about BGA bond wire package. I am not sure whether it is the right place where i post this topic.

1, Some material says the path from chip pads to the ball of BGA consists of bond wire, trace, via and solderball. The question is that usually the length of trace is on mm level, which means above certain signal frequency the trace should be treated as a transmission line, but how to properly terminate this transmission line or to reduce the concomitant noise of reflection in practice, considerating that two ends of the trace are bond wire and via which both have different impedance from the pcb fr4?

2, If I get a package model, saying parasitic r/c/l, how can i integrate this model into the ASIC backend design flow? For example, how can i use this model to estimate the SSN noise of the pose-packaging chip?

3, What is the difference between 'partial self inductance' and 'loop inductance', what property of material does they indicate respectively, what is the exact meaning of 'partial' in 'partial self inductance'?

So boring,

Any help will be appreciated, thanks!
 

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