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Which option is better for connecting a fill around a PAD?

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About the filled area

In layout design ,when you add a fill around a PAD,there is two choice
one is connect it directly,the other is by a cross line .
For consider manufacture which is better ?why
 

It easier to solder and desolder when you use cross line. When you connect directly it demands much more heat to solder, because the heat is easier tranfered to the fill area.
So normally you should choose cross line to get proper soldering whitout cold solder joints.

**broken link removed**
 

Thermal relief

The spoked method is called thermal relief. Before the days of RF this was the standard method even for vias. Now that RF products are common the solid fill is also an option.

If you are doing a RF card put the solid everywhere there is no soldering.
 

I want to fill an area under a PAD of power supply in Layer2.
Because my layer1 to layer2 used microVia and use burned-via from layer 2 to Power layer, I also worry about which is better for large current.
It's a fill for just a little space.
 

high current

If you are distributing high power supply current you should put many vias in parallel. This will reduce both the parasitic resistance and inductance. If you will not be soldering to the vias do not use thermal reliefs. Many layout programs will allow you to do this.
 

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