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the max distance between PAD and scribe line ring is 200 u,w

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1. the max distance between PAD and scribe line ring is 200 u,why?

2. i want to add PAD in the middle of chip , Was it feasible? Than means PAD have to around the chip ?
 

what does put PAD in the middle?

How about you die? It is empty in the middle or circuit under PAD ?
 

Re: the max distance between PAD and scribe line ring is 200

The die has a higher elevation then the package's pins. Therefore the bond-wire must not only travel across the die, but also downwords. A pad that is inside the chip forces the bond-wire to have a slow descent because it must clear the die before being allowed to go below it. The slowest descent that still will allow the bondwire to reach the packages pins level dictates how far into the die the pad can be placed. This is just one aspect, because bondwire length, loop size, etc... all affect this.

Greg
 

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