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ASIC process technology comparison

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steven852

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Hi,

I wonder if someone can point out some reference materials to show the key features and difference between BiCMOS, CMOS, and SOI, and some other new technology in ASIC design. What I mean "features" include speed, cost, and how to make decision to choose which one to pick.

Thanks in advance.
 

https://www.freescale.com/webapp/sps/site/overview.jsp?nodeId=0121000303

this link shows an overview of the BiCMOS and SOI processing technologies, but in general, i'd say that these technologies are used for different applications compared to the general CMOS circuits. Wherever there is a need for higher frequency or high power applications, alternative processing solutions are used. This is my understanding.
 

Thanks for the link. One point is not very clear to me is that how to make selection on different processes. For example, what are the key considerations of choosing BiCMOS over CMOS, or, up to what speed BiCMOS is a better candidate. Also, is there any horizontal process comparsion among major foundry providers?

Thanks.
 

BiCMOS is used where you need extremely high speed. It generally consumes more power than regular cmos and costs more to manufacture. Most foundries offer BiCMOS at some process node but cost/power considerations prevent people from using them unless they really need high speed/drive.

SOI is generally faster and lower power than regular CMOS, however a couple of points are preventing it for getting into the main stream:
1. Few foundries offer the process (mainly CPU vendors AMD, IBM, etc. ... not TSMC, UMC, Chartered, etc.)
2. Current ASIC CAD tools not fully ready for SOI effects (history effect in timing, etc.)
 

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