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How do I determine package modeling?

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020170

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packaging vendors ipac

When I designed Full custom circuit, I have to consider inductance in boning wire.

Becuase it affect some clock signal or mixed signal especailly at high frequency.

some poor Fabrication do not offer package modeling files. It is terrible for circuit designer.

that is true, nevertherless, I believe that some generalized package model exists in each minimum L , like 0.35 , 0. 18 .. etc

how about your opinion? and How do I determine package model for accurate simulation result?

Does MOSIS offers package modeling file? or Where do I get that?

thanks
 

**broken link removed**

Electrical parameters of the bondwire used by MOSIS's packaging vendors is listed in the site above. IPAC is one such vendor. You can get exact model of package parasitics (including pin) from their support team too.

Regards
Maddy
 

    020170

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