Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

In RF circuit design, which ground method is better?

Status
Not open for further replies.

tony_taoyh

Full Member level 2
Joined
Oct 20, 2004
Messages
131
Helped
6
Reputation
12
Reaction score
3
Trophy points
1,298
Activity points
1,785
Hi,

In RF circuit design, using microstrip,
which gound methos is better?

(1) Use Via to ground; (layer 2 is ground layer)

(2) Use 1/4 of wavelength (open stub).


Please give a short explaination.

Thanks.
 

I think :
below 2GHz use via to grond
above 2GHz use 1/4 of wavelength(open stub)
 

Hi: I think it really depends upon many things. If it is narrow bandwidth, you may be able to achieve very good ground at a particular frequency usng 1/4 lambda. However, the 1/4 lambda stub will not work for wide bandwidth. Grounding via should give reasonable good ground over relatively wide frequency range from 0 to some high frequncy. However, it will have some inductance there and this inductance will become more and more important at high frequency. Regards.
 

Status
Not open for further replies.

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top