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about the pad layout and design

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J

jiangwp

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For multiple metal pad layout,

i want to know which mtal layer from internal ciruit is connected to the pad?

for example , the three metal process,

1. when the internal signal must connect to the pad for bonding, which metal

shoud be use to connect to pad? and why?

2. do all pad need the all metal layers(metal1, via1,metal2, via2, ]

metal3,opening)? and why ?

3. are there difference between pad via and the internal via of circuit core?

and why?
 

Hi,
Generally, the pad layout includes each of the process metal levels : metal1, metal2, metal3,..., metalN.

Regards,
 

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