[Moved]facing issue on thermal angle in PCB

Hi,
i am using one power supply board, in that some coils are placed on surface of PCB middle which is dissipating more than 7W on board, i need to take out heat from the PCB middle to chassis. is there any method available, please help me.

Re: facing issue on thermal angle in PCB

A fan to move the air

Re: facing issue on thermal angle in PCB

Hi,
Actually we made a mechanical box, inside this PCB is there.
We provided Mechanical ribs for stiffness, both top and bottom side components are placed. On PCB it is dissipating 7W, but because of both side components we cant able to provide thermal Vias on PCB where mechanical rib touching PCB. please provide me any solution how to take heat to mechanical rib.

Re: facing issue on thermal angle in PCB

Did you even look at where you posted this? This has nothing to do with programmable logic and should have been posted in the Hardware and PCB Design area. Next time look BEFORE posting.

The reason you are having a power dissipation issue is because you didn't design for it. Now that you have a board and "discovered" you have to dissipate 7W. Now you are trying to figure out a way to transfer the heat to the ribs after the fact. Well unless you do a proper thermal analysis, you'll probably under design the heat dissipation (if you even design it in the first place, I doubt you will).

My recommendation: redesign the board so it can dissipate 7W. Trying to fix a board with thermal problems (due to no thermal design) will waste more time and resources than redesigning everything from scratch (taking into account the thermal design).

You are right. Thread moved lately.

Re: facing issue on thermal angle in PCB

Okay I agree,
But is there any tools or tutorials for PCB layout with thermal analysis for high volt power supply design/DC-DC converter design.
If there please provide me.

The power dissipation is most likely caused by either excessive resistance of the coils, core saturation or both. Selecting coils with higher current capabilities (lower ESR) may already fix the problem because less heat will be generated in the first place.

The laat places I worked at both used Flowtherm for analysis of temps.

Well firstly we would need more information, drawings etc to provide any sort of educated guess or you can go and look at the aavid and bergquist sites as they have lots of information on thermal engineering.

Got to agree with the cold one, trying to reduce the heat generation in the first place would be the best option.