Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

Footprint for WLCSP package

Status
Not open for further replies.
A

arunmaran10

Junior Member level 2
Joined
Jan 2, 2014
Messages
22
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,281
Activity points
1,435
Hi all,
I want to know the size of micro via for .265mm pad and .4mm pitch WLCSP package.
For the same i want to know whether via on SMD pad is possible if so what will be the dia of that micro via.

Regards,
Arunmaran
 

Hi,

Best is to go to the chip manufacturer's homepage ( if not in the datasheet) and find it's pcb layout recommendations.
Or go for IEC standards.

Klaus
 

IEC standards!!!!
The footprint standard for surface mount devices is IPC-7351 if you are serious about PCB design I would recommend getting to know this standard.

As to microvias, generally based on a 0.1mm pad with a 0.3mm target area...in your case and mine in the past I have done a micro via with a land the same size as the width of the pad for the device and talked very nicely to my PCB manufacturer, it is doable.
 

Status
Not open for further replies.

Similar threads

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top