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How to create a Bond pad?

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mikcup

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Hi all,

I'm assigned to layout for a Bond pad but i'm not clear.
I would like to know which layers are used in a Bond pad, the way to create, and are there any documents about it?

Thanks much.
 

top and bottom layer is ok. but in the area of bond have to layout with top/bottom solder.
the pad as usual without any defferent.
 
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    mikcup

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Thanks Armoric.

Do you have any piture or document? it'll help me much.
 

Why IOs are operated at higher voltages and Cores are operated at lower voltages?
 

why do you mean by bound pad, the metal area where the bound wire will be connected?
there is two type of bound pad, with CUP or not, here CUP mean circuit under pad, which means some top METAL layers are used for the bound area, and the lower layer are used to implement the pad functionality.
 

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