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How to chose metallization MxMyMz in design

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R1kky

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Hi All,

Please explain issues in metallization tape.

Can anyone tell what is the difference among various metallization choices such as X, Y, Z, N, R, U.

Thanks in advance
 

don't beleive that nobody can help me :razz:
 

R1kky said:
Hi All,
Can anyone tell what is the difference among various metallization choices such as X, Y, Z, N, R, U.
Thanks in advance
Click to expand...

The alphabets mentioned above are codes for metallozation.

Each code has unique W/S (pitch), thickness and metal layes.

Eg:
Code-W/S-Thickness-Mask layer
Mx-0.1/0.1-900- M2,M3 Layers
My-0.2/0.2-1900-M5,M8

Hope this helps.
 
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    R1kky

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Thanks, Prashanthanilm.
ofcourse it clarify several moments to me.
but what is W/S (width/... ?) thickness in nm?
 

Pitch refers to Width+Spacing.
Eg:
Metal width 0.05nm
Metal spacing 0.05nm.(Metal to Metal spacing).

Yes , the scaling will be in nm. (technology actually-->180nm,130nm,20nm)

- - - Updated - - -

Thickness will be in angstrom.
 
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    R1kky

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and one more dummy question - after all, why exactly Mx, My, ... ?

what the main difference between them?
 

R1kky said:
and one more dummy question
Click to expand...

Question which is not asked is Dummy Question:).

Mx,My,Mz,Mr,Mu are Metallization Layers.

They are Top level layers. Since for Power bus routing and all, we dont want to lose power with IR drop.
So, here we want to reduce the Resistance, So we used higher thickness layers.

We can use anyone of them as Top level layers depending on the requirement.

For normal layout purpose, M1-M8 is more than sufficient.

Difference is Pitch,Thickness,Mask Layers.
 
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    R1kky

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i guess it's enough for me for now, thanks a lot for your attention.
 

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