robismyname
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I have a trivial question about board stackups between 4 layers and 2 layers pcb's
All of my training documents use 4 layer boards. Using layer 1: top, layer 2: ground, layer 3: power, layer 4: bottom.
I have a few questions about the board stackup.
1) The top layer is a signal layer?
2) The bottom layer is a signal layer?
3) In my training documents the CAM planes (power and ground) are in the middle. If i were to design a 2 layer board with layer 1: top, layer 2: bottom. Is it ok to make the top layer the signal path and the bottom layer ground? or do I have to add a third layer called bottom and place the ground between the bottom and top?
All of my training documents use 4 layer boards. Using layer 1: top, layer 2: ground, layer 3: power, layer 4: bottom.
I have a few questions about the board stackup.
1) The top layer is a signal layer?
2) The bottom layer is a signal layer?
3) In my training documents the CAM planes (power and ground) are in the middle. If i were to design a 2 layer board with layer 1: top, layer 2: bottom. Is it ok to make the top layer the signal path and the bottom layer ground? or do I have to add a third layer called bottom and place the ground between the bottom and top?