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What are the issues in single chip integration ?

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Single Chip Integration

Hello


What are the issues in single chip integration when the chip has analog, rf, and digital as well as baseband blocks... should everything be differential ? do you need good process for isoltation ? careful layout ?

what other isses are there ? floorplanning ?

any papers, thesis or books or opinions would be helpful !

thanks
 

Re: Single Chip Integration

Hi:

Some of the requirements are highlighted as below:

1. Better isolation and shielding, due to crosstalk and substrate coupling.

2. Good floorplanning, especially in designing high power devices such as PA due to thermal constrain.

3. Interstage matching for maximum power transfer.

4. Differrential architecture is preferred , for better linearity, but tradeoffs with higher power dissipation.

Hope this helps.

Rgds
 

Single Chip Integration

you should seperate it in parts.just as digital ,analog&mixer.it's ground should be careful.
 

Re: Single Chip Integration

I think don't forget ohmic law, IR drop, ground bounce due to inductance.
On chip isolation, take care the guard ring, even the seal ring alos makes
issues. Identify the blocks which are sensitive, noisy..etc.
 

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