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Basic question about PCB stack up.

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Sink0

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I already asked a very specific question regarding this subject on this thread: https://www.edaboard.com/threads/223562/

However i am looking for a more generic answer here. I have looked around and seems to exist many variations on pcb stack up for a 4 layer boards. However i could not find some real comparison between all the possible combinations.

As i commented other thread, Freescale recomends the use of several stack up, bu none of them seems to be the standard one (with GND and VCC on the middle layers). Ignoring the design itself, and the easyness to route, what are the technical advantages and disadvanatages of each possible stack up?

Thank you!
 

Sink0,


I already noticed at the layout guideline provided from a specific manufacturer, the recomendation to place power routing ( GND + Vsupply ) at inner layers. However, I disconsidered this orientation, and performed like you posted at the other thread.

Seems to be intuitive to avoid exposure signals at peripheral layers.
Power planes on Top/Botton layers could drain electromagnetic interference, shielding internal signals.


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